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Category Tag: Carrier Tape

Embossed carrier tape provides protection to integrated circuits and other devices from physical and electro-static discharge (ESD) damage during shipping and storage. Carrier tape is widely used for presenting devices to pick-and-place machines for automatic placement onto printed circuit boards. 
Advantek’s carrier tape can incorporate containment features found in more expensive shipping media. This provides fragile devices – such as QFP’s, chip scale packages and bare die – protection from physical damage. 

Standard Carrier Tape

Advantek standard carrier tapes are provided in single and level wind reel configurations. The number of meters of carrier tape that will fit on a given reel is conditional upon the pocket pitch, pocket depth and reel configuration. Standard carrier tape is manufactured in accordance with EIA, JIS and EIAJ standards in a range of widths from 8mm to 200mm, and lengths up to 1000 meters, depending on the size and orientation of the device being packaged. Advantek will use a manufacturing process and material to ensure your requirements are met.

Several single-wind reel flange diameters are available, including 13 inch, 22 inch (standard) and 30 inch. Level-wind reel flange diameters include 14.25 inch, 22 inch and 30 inch.  Both corrugated paper and corrugated plastic reel flanges are offered.

Complex Carrier Tape

Advantek carrier tapes with complex designs have the same performance features as tapes with standard designs. However, they commonly contain pocket features such as chisels, wall features, pedestals, tapers, corner reliefs, raised bridges and more. These design elements ensure your devices are contained and presented precisely and securely in form fitted pockets.

Advantek’s large tape forming technology enables creation of the industry’s widest and deepest pockets; with widths up to 200 mm and depths over 25 mm.

This is the ideal solution for connectors, mechanicals, MEMs, SIPs or any component with odd angles, and various dimensional features.

High Precision Carrier Tape

Advantek high precision carrier tape was developed specifically for small form factor devices having precision packaging and confinement requirements. Razor sharp radii and near-vertical side-wall draft angles keep devices level and stable in the pocket, helping to prevent abrasion and reducing pick errors.  Advantek’s high precision carrier tape is an excellent fit for WLCSP, bare die and flip chip devices.


SURFTAPE® is a unique form of punched carrier tape ideal for bare die or small devices where protection and placement are critical. Components are placed on a wafer film backing within a compartment boundary. Unlike conventional embossed tape, the compartment does not have to be sized to the component, eliminating the need for custom carrier tape tooling. Traditional cover tape is also not required. Both elements reduce inventory management costs. SURFTAPE® is also an excellent solution for shipping prototypes or early production runs. Since SURFTAPE® comes in standard sizes there is no long wait for tape design, custom tooling and manufacturing leadtimes.

/ Ideal for bare die, chip scale packages, MEMs, LEDs, and micro thin components. Devices are held safely in place – preventing corners, edges and surfaces from contacting the packing material

/ Wafer film base secures the devices in the exact position they are placed, no theta correction is required

/ One tape size can fit a multitude of component sizes > No tooling cost or large minimum order costs

/ Supporting semiconductor industry packaging standards:
   / EIA 747
   / EIA 481
   / JIS C0806
   / IEC 60286-3

Interleaf / Bump / Spacer Tape

Advantek’s wide range of forming processes provides a variety of unique solutions for specialty applications. The Protective Interleaf Tape™ is designed to separate sensitive components such as flex circuits or components manufactured in a continuous strip. Packaged components have minimal contact with the tape, making it ideal for storage and shipment of small, thin and lightweight component devices. These forming technologies are available to support custom projects.

  • Designed to protect sensitive thin-layer components during shipping and storage
  • “Bump” feature on the edges of tape allow for only minimal contact with packaged components
  • Cleanroom process option available
  • Static-dissipative to protect ESD-sensitive components from electrostatic discharge