SURFTAPE® is a unique form of punched carrier tape ideal for bare die or small devices where protection and placement are critical. Components are placed on a wafer film backing within a compartment boundary. Unlike conventional embossed tape, the compartment does not have to be sized to the component, eliminating the need for custom carrier tape tooling. Traditional cover tape is also not required. Both elements reduce inventory management costs. SURFTAPE® is also an excellent solution for shipping prototypes or early production runs. Since SURFTAPE® comes in standard sizes there is no long wait for tape design, custom tooling, and manufacturing lead times.

/ Ideal for bare die, chip-scale packages, MEMs, LEDs, and micro-thin components. Devices are held safely in place – preventing corners, edges, and surfaces from contacting the packing material

/ Wafer film base secures the devices in the exact position they are placed, no theta correction is required

/ One tape size can fit a multitude of component sizes > No tooling cost or large minimum order costs

/ Supporting semiconductor industry packaging standards:
   / EIA 747

Material properties

Property Typical value Test Method
Specific Gravity 1.12 g/cc ISO 1183
Tensile Strength 29 Mpa ISO 527
Tensile Elongation 40% ISO 527
Flexural Strength 46 Mpa ISO 178
Heat Distortion 85°C ASTM D1525
Surface Resistivity ≥104, <108 Ohms/Sq ASTM D257
Carrier Tape Thickness 0.64 & 0.84 mm EN 1942
Adhesive Tape Thickness 0.075 mm EN 1942
Total Thickness 0.724 & 0.924 mm EN 1942


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