Taiwan’s United Microelectronics Corp. plans to build a new advanced manufacturing facility in Singapore which will be a huge help with growing demand. “The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024.” To find out more, click here.
Advantek will exhibit at SMTconnect in Nürnberg, Germany on May 10-12, 2022.
“SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.”
Visit us at booth 345 in Hall 4 to learn more about our advanced line of carrier tape, cover tape, reels, and more.
To read more about SMTconnect, visit here.
With an exciting rise in stocks and decreased supply issues, Qualcomm CEO Cristiano Amon said the company will have enough supply to meet demand by the second half of next year. Read more here.
The top 10 largest OSATs (outsourced semiconductor assembly and test) had excellent growth in 1Q2021. Revenues for these companies reached 7.17 billion dollars in 1Q2021, a 21.5% increase YoY, with most of these companies recording double-digit growths. Read more below:
As the chip shortage continues to impact the global electronics market, there has been a steady flow of articles describing the situation and how we got here. One of the best articles we have found is from Bloomberg. It provides excellent information on the evolving demand for chips, supply chain issues, the manufactures, and the end markets factors. To read all about it, visit:
www.bloomberg.com/graphics/2021-semiconductors-chips-shortage/
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. Southeast Asia is quickly becoming a major contender as a world-class electronics manufacturing hub. The show allows experts and world leaders in the industry to connect and share their advancements and new technologies. SEMI is committed to connecting members with the goal to create new markets and meet common industry challenges.
SEMICON Southeast Asia 2019 will be held May 7-9, located at the The Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia. Visit Advantek’s booth, 1316, to learn more about our advanced solutions for BARE DIE, LEDs, WLFOP, MEMs, and emerging package requirements for automotive, IoT, and high-performance computing applications. Advantek offers the most complete carrier tape solution in the industry–high precision carrier tapes, cover tapes, packaging reels, moisture barrier bags, and more.
For more information on SEMICON Southeast Asia 2019, visit here.
©Mesago/Mathias Kutt
Advantek will exhibit at SMTconnect in Nurembuerg, Germany on 7-9 May 2019.
Previously known as SMT Hybrid Packaging Conference, SMTconnect organizes over 400 exhibitors from 30 different countries. Join Advantek alongside some of the world’s leading experts in the electronic manufacturing industry.
Visit us at booth 226 in Hall 4 to learn more about our advanced line of carrier tape, including high precision tape for bare die, cover tape, reels, and more.
To read more about SMTconnect 2019, visit here.
At Advantek, we believe in the power of excellent engineering. Earlier this year, the company established four new engineering teams of experts that strive to implement excellence in a strategic way.
Advantek manufactures and delivers industry-leading carrier tape for customers across the world. From large mechanical devices to advanced micro-components, the company offers a variety of solutions that promise to carry and protect any device.
In order to produce high-precision tape, the company uses an array of manufacturing processes. Each process excels with its own unique set of capabilities. Yet, all are tailored to produce the most dependable designs and solutions available in the industry.
Recently, the company created and assigned four teams of experts to focus on their manufacturing processes. The goal? To excel in productivity and technology leadership. They work to utilize the company’s engineering resources and capabilities in the most effective way possible.
These team are called Centers of Excellence (CoE). Teams of engineers make up each CoE and welcome the challenge and responsibility to advance manufacturing technologies. The teams focus on productivity, quality, and process advancements. Engineers are encouraged to be innovative and forward-thinking in developing new carrier tape solutions.
“The ideas that can result from CoE discussions can never be replaced by any other method”, says Todd Oliverius, Senior Mechanical Engineering Designer. “Working in a team can be inspiring, and fun, which leads to increased productivity and creativity around advancing our manufacturing processes and technologies.”
Together, the CoE’s collaborate to produce the most advanced technologies in the industry. They are responsible for overseeing and managing quality, dimensions, product and process designs, and materials related to each manufacturing process. In this way, every concern or question is always addressed by technology experts. Their efforts output industry-leading process capabilities.
“The CoEs are implementing new operational initiatives aimed at optimizing productivity, driving down costs, and improving quality,” says Tom Skrtic, V.P. of Engineering. “We’ve already seen many improvements implemented with more to follow. The teams are also focused on long-term goals within their area of expertise–adding equipment to the processes to make them more precise and robust. The teams are actively working on multiple ways to improve processes, materials, and technologies now and in the future.”
Photo © SEMICON Taiwan
Since 1971, SEMICON Taiwan has committed to helping its members grow and learn more about their markets and industry challenges. Serving as a global industry association, SEMI supports the manufacturing supply chains for the microelectronics, display and photovoltaic industries. The association connects industry leaders and innovators with the purpose to drive smarter, faster, and more economical products each year.
In early September, Advantek exhibited alongside hundreds of other global members at SEMICON Taiwan 2018. This year’s conference focused on connecting, collaborating, and innovation. The event saw more than 36,000 visitors and displayed over 600 exhibitors.
Advantek’s booth saw new and long-time customers, all stopping by to meet with our Taiwan sales team. Many discussed new carrier tape solutions for their current and future packaging needs. Other discussions centered around precision fit for advanced semiconductors, WLFOP, chip scale packages, and bare die.
“We joined SEMICON over 20 years ago. Every year, we enjoy meeting with customers and experiencing everything the show has to offer,” says Jessica Wu, Taiwan Sales Manager.
SEMICON Taiwan 2018 proved to be another excellent event for Advantek to join forces with other industry leaders and connect with our dedicated customers from around the world.
For more information on SEMICON Taiwan, visit here.