Tag: Carrier tape

Advantek and Winpack Forge Strategic Partnership to Enhance Global Packaging Solutions

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Eden Prairie, Minn., November 4, 2024 — Advantek, LLC (“Advantek”), a leading provider of precision component delivery systems, today announced a strategic partnership with Jiangyin Winpack Tech Co., Ltd. (“Winpack”), a recognized provider of precision packaging solutions headquartered in China. Advantek’s collaboration with Winpack’s Eurasia group marks a significant step in aligning the strengths of both companies to serve global customers more effectively, while enhancing Advantek and Winpack’s combined capabilities and reach.

Headquartered in Eden Prairie, Minnesota, Advantek operates manufacturing facilities in Taipei, Manila, Penang, Shanghai, Eau Claire (U.S.) and Laxå (Sweden). For over 40 years, Advantek’s precision-engineered specialty packaging tape has supported the safe transport and presentation of high-value semiconductor and electronic components. These solutions play a vital role in assembling products such as computers, mobile phones, LED lighting, medical devices, smart appliances, automobiles, and various consumer products. In 2022, Advantek partnered with Cornell Capital, a U.S.-based private investment firm, to accelerate initiatives to provide customers with optimal efficiency and flexibility across a global manufacturing footprint.

Through this latest strategic partnership, Advantek will benefit from Winpack’s established market presence, unlocking new high-volume opportunities and strengthening its global footprint, particularly in Asia. In turn, Winpack will gain access to Advantek’s comprehensive range of products and technological capabilities, enabling Winpack to offer customers an expanded portfolio by utilizing existing product offerings and advanced design expertise.

“This strategic partnership represents an important step forward in aligning our group with a global customer base and ensuring we continue to deliver the same level of consistent product excellence and high-quality service,” said Wim Goossens, President & CEO of Advantek. “By combining our strengths, we can better meet the evolving needs of the international market.”

“Partnering with Advantek allows us to accelerate our capabilities in serving the entire market, including providing the most precise and clean tolerances in the carrier tape market,” said Tim Lee, General Manager of Winpack. “We are excited to enhance our small form factor offerings and deliver the high degree of cleanliness that our customers demand.”

“As a leading provider of packaging solutions globally, Advantek has been focused on growing its presence in key international markets,” Allen Chu, Partner at Cornell Capital. “Through this partnership with Winpack, Advantek will be even better positioned as a best-in-class, global provider of precision component delivery systems, benefiting from Winpack’s two-decade presence in China.”

 

About Advantek

Advantek is a leading provider of precision component delivery systems with facilities in North America, Asia, and Europe. Advantek’s solutions play an important role in the assembly process of products such as computers, mobile phones, LED lighting, medical components, smart appliances, and automobiles. For more information, visit www.advantek.com.

 

About Cornell Capital

Cornell Capital is a U.S.-based private investment firm with approximately $5.5 billion of AUM and offices in New York and Hong Kong. Leveraging decades of global investment experience, the firm takes a disciplined approach to investing across the industrials, business services, financial services, and consumer sectors, often in companies that can benefit from the firm’s Asia presence and cross-border expertise. Founded in 2013 by Senior Partner Henry Cornell, the former Vice Chairman of Goldman Sachs’ Merchant Banking Division, the firm is led by a highly seasoned team with significant shared investment experience. For more information, visit www.cornellcapllc.com.

 

For Media Inquiries:

Advantek:
George Carbone
Executive Vice President and CFO
+1 715-833-1677

Cornell Capital:
Kate Thompson / Erik Carlson / Madeline Jones
Joele Frank, Wilkinson Brimmer Katcher
+1 212-355-4449

Visit us at SMTconnect 2022

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Advantek will exhibit at SMTconnect in Nürnberg, Germany on May 10-12, 2022.

“SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.”

Visit us at booth 345 in Hall 4 to learn more about our advanced line of carrier tape, cover tape, reels, and more.

To read more about SMTconnect, visit here.

Industry News: Global Governments Ramp Up Pace of Chip Investments

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The global race for countries to advance their own semiconductor capabilities and capacity is ramping up. The strategic significance of semiconductors and their ever-increasing importance for economic competitiveness and supply-chain resilience has become a focus for governments worldwide. Read more:

Industry News: Chip shortage continues

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As the chip shortage continues to impact the global electronics market, there has been a steady flow of articles describing the situation and how we got here. One of the best articles we have found is from Bloomberg. It provides excellent information on the evolving demand for chips, supply chain issues, the manufactures, and the end markets factors. To read all about it, visit:

www.bloomberg.com/graphics/2021-semiconductors-chips-shortage/

SEMICON Southeast Asia – 2019

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SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. Southeast Asia is quickly becoming a major contender as a world-class electronics manufacturing hub. The show allows experts and world leaders in the industry to connect and share their advancements and new technologies. SEMI is committed to connecting members with the goal to create new markets and meet common industry challenges.

SEMICON Southeast Asia 2019 will be held May 7-9, located at the The Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia. Visit Advantek’s booth, 1316, to learn more about our advanced solutions for BARE DIE, LEDs, WLFOP, MEMs, and emerging package requirements for automotive, IoT, and high-performance computing applications. Advantek offers the most complete carrier tape solution in the industry–high precision carrier tapes, cover tapes, packaging reels, moisture barrier bags, and more.

For more information on SEMICON Southeast Asia 2019, visit here.

SMTconnect – 2019

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Advantek will exhibit at SMTconnect in Nurembuerg, Germany on 7-9 May 2019.

Previously known as SMT Hybrid Packaging Conference, SMTconnect organizes over 400 exhibitors from 30 different countries. Join Advantek alongside some of the world’s leading experts in the electronic manufacturing industry.

Visit us at booth 226 in Hall 4 to learn more about our advanced line of carrier tape, including high precision tape for bare die, cover tape, reels, and more.

To read more about SMTconnect 2019, visit here.

Four Teams of Experts, One Powerful Goal

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At Advantek, we believe in the power of excellent engineering. Earlier this year, the company established four new engineering teams of experts that strive to implement excellence in a strategic way.  

Advantek manufactures and delivers industry-leading carrier tape for customers across the world. From large mechanical devices to advanced micro-components, the company offers a variety of solutions that promise to carry and protect any device.

In order to produce high-precision tape, the company uses an array of manufacturing processes. Each process excels with its own unique set of capabilities. Yet, all are tailored to produce the most dependable designs and solutions available in the industry.

Recently, the company created and assigned four teams of experts to focus on their manufacturing processes. The goal? To excel in productivity and technology leadership. They work to utilize the company’s engineering resources and capabilities in the most effective way possible.

These team are called Centers of Excellence (CoE).  Teams of engineers make up each CoE and welcome the challenge and responsibility to advance manufacturing technologies. The teams focus on productivity, quality, and process advancements. Engineers are encouraged to be innovative and forward-thinking in developing new carrier tape solutions.

“The ideas that can result from CoE discussions can never be replaced by any other method”, says Todd Oliverius, Senior Mechanical Engineering Designer. “Working in a team can be inspiring, and fun, which leads to increased productivity and creativity around advancing our manufacturing processes and technologies.”

Together, the CoE’s collaborate to produce the most advanced technologies in the industry. They are responsible for overseeing and managing quality, dimensions, product and process designs, and materials related to each manufacturing process. In this way, every concern or question is always addressed by technology experts. Their efforts output industry-leading process capabilities.

“The CoEs are implementing new operational initiatives aimed at optimizing productivity, driving down costs, and improving quality,” says Tom Skrtic, V.P. of Engineering. “We’ve already seen many improvements implemented with more to follow. The teams are also focused on long-term goals within their area of expertise–adding equipment to the processes to make them more precise and robust. The teams are actively working on multiple ways to improve processes, materials, and technologies now and in the future.”

SEMICON Taiwan 2018 Recap

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Photo © SEMICON Taiwan

Since 1971, SEMICON Taiwan has committed to helping its members grow and learn more about their markets and industry challenges. Serving as a global industry association, SEMI supports the manufacturing supply chains for the microelectronics, display and photovoltaic industries. The association connects industry leaders and innovators with the purpose to drive smarter, faster, and more economical products each year.

In early September, Advantek exhibited alongside hundreds of other global members at SEMICON Taiwan 2018. This year’s conference focused on connecting, collaborating, and innovation. The event saw more than 36,000 visitors and displayed over 600 exhibitors.

Advantek’s booth saw new and long-time customers, all stopping by to meet with our Taiwan sales team. Many discussed new carrier tape solutions for their current and future packaging needs. Other discussions centered around precision fit for advanced semiconductors, WLFOP, chip scale packages, and bare die.

“We joined SEMICON over 20 years ago. Every year, we enjoy meeting with customers and experiencing everything the show has to offer,” says Jessica Wu, Taiwan Sales Manager.

SEMICON Taiwan 2018 proved to be another excellent event for Advantek to join forces with other industry leaders and connect with our dedicated customers from around the world.

For more information on SEMICON Taiwan, visit here.

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