News

Advantek introduces DRYLOK3410 Moisture Barrier Bag

Advantek introduces a new static shielding/Moisture barrier bag: DRYLOK3410. It is developed to contain trays, tubes and 13” shipping reels and custom sizes.

It meets IPC/JEDEC standard J-STD-033B.1 (ver. 2007) in terms of Water Vapor Transmission Rate, equal or lower than 0.002gm/100in2/day. It provides the puncture resistance at about 19 lbs. Flexographic and hot stamp printing is available for logo label and customized label for high volume demand, which protect from erasing.

click here to download the bags product overview. 

Advantek continues to be the leader in component packaging products for the semiconductor industry – from embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC, desiccant and wafer laminating tape

Advantek introduces type ‘AD’ cover tape

Advantek introduces a high performance heat-activated cover tape: “AD” cover tape. It is suitable for sealing with the carrier tape of both PS and PC material.

The AD cover tape is a halogen free cover tape which is suitable for fast taping application with good peel back force (PBF) stability; it has low haze, high transmittance and clarity; suitable for both manual and automatic inspection; and excellent anti -static protection.

click here to download a cover tape product overview. 

Advantek continues to be the leader in component packaging products for the semiconductor industry – from embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC, desiccant and wafer laminating tape.

Advantek introduces type ‘P’ material carrier tape for low cost applications

Further addressing the needs of customers in our competitive market, Advantek introduces type P material. Type P is a polystyrene (PS) offering good strength and protection at a lower cost than standard material types. It comes in various thicknesses (0.2mm, 0.25mm, 0.3mm and 0.35mm) for use in 8 and 12mm width carrier tape.

The material is designed for high volume carrier tape demand at a pre-determined reel length; targeting devices like SOIC8, SOT23 and other passive/discrete devices.

click here to download a carrier tape product overview. 

Advantek continues to be the leader in component packaging products for the semiconductor industry – from embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC, desiccant and wafer laminating tape.

Expo Electronica 2011

Come see us April 19th – 21st at ExpoElectronica in Moscow.

The exhibition focuses on electronic components and innovative electronics production – drawing a wide range of high profile visitors.

“The electronics industry has become key in Russia and we are looking forward to further introduce tape and reel packaging solutions to local customers – especially at the LEDTECH forum which takes place for the first time this year”, said Axel Held, Channel Manager. “We appreciate the ongoing effort of our local partners, Radiant-Elcom, to help us connect with the opportunities in this area.” 

Advantek continues to advance component packaging for the semiconductor industry. From embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC, desiccant and wafer laminating tape, trust us to be your one stop, high volume global source.

AUTOMATICON 2011

Come see us at AUTOMATICON 2011 in Warsaw, Poland, April 5-8, 2011

Hall 4, Booth L22.

http://www.automaticon.pl/english/

We are excited to participate for the first time and exhibit in partnership with WG Electronics Sp. Automaticon 2011 is an important automation, control, measurement and robotics exposition in the region. Its mission is to promote new technologies and solutions for the electronics industry.

Advantek will have its full line of embossed carrier tape, cover tape and LOKREEL (packaging reels) representated. As well as HIC, desiccant and wafer laminating tape.

SMT HYBRID PACKAGING 2011

Come see us at SMT HYBRID PACKAGING 2011 in Nuremberg, Germany, May 3-5, 2011, Booth 7-222.

http://www.mesago.de/en/SMT/For_visitors/Welcome/index.htm

The show aims to offer for exhibit and discussion the latest products, services and solutions in the field of electronic manufacturing – covering from assembly, PCB and soldering to test.

Advantek continues to advance component packaging for the semiconductor industry. From embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC desiccant and wafer laminating tape, trust us to be your one stop, high volume global source.

Semicon China 2011, Shanghai

Come see us at Semicon China 2011 in Shanghai – March 15-17.
Our booth is 2775 in hall W2.

http://www.semiconchina.org/index.htm

“Semicon China is a great opportunity for us to present products and express continued enthusiasm about the industry in the region”, said Victor Tay, Product Manager. “We look forward to discussions with existing customers and helping new ones get their products to market safely and cost effectively.” 

Advantek will have its full line of embossed carrier tape, cover tape and LOKREEL (packaging reels) on display. As well as HIC, desiccant and wafer laminating tape.

ChipEXPO, Moscow

ChipEXPO 2010

Come see us at ChipEXPO, Moscow. October 26-28, 2010, Booth 1-4.  Advantek will exhibit with its regional Representative, Radiant-Elcom.  www.radiant.su

http://chipexpo.chipexpo.ru/eng/

The semiconductor industry continues its growth in this region and Advantek intends to remain at the front of tape and reel supply. Our embossed carrier tape, cover tape and LOKREEL products are readily available and well represented by Radiant-Elcom.

“We are excited to participate again this year at ChipEXPO. Our unsurpassed quality and capacity matches well with Radiant-Elcom’s reach in the area.”, said Axel Held, Channel Manager, Advantek Inc.  Russia and Radiant-Elcom are serviced through our direct Sales & Distribution center in Freiburg Germany.

Electronica 2010, Munich

Electronica 2010

Come see us at Electronica, Munich. November 9-12, 2010. Booth A2/270.  For details on the show or to register as a visitor, please visit the link below:
http://www.electronica.de/en/

“Electronica continues as an important opportunity to touch base with existing relationships as well as introduce our component packaging products to new opportunities”, said Britta Menzel, Co-Director Sales EMEA.

Advantek will have its full line of embossed carrier tape, cover tape and LOKREEL (packaging reels) on display. As well as HIC, desiccant and wafer laminating tape.

Introducing ‘J’ series carrier tape for burr reduction

Advantek introduces ‘J’ series carrier tape for additional control over burrs.

Reducing potential sources of particulates during assembly, test and transportation continues to grow in importance. ‘J’ series carrier tape provides notably tighter burr control for carrier tape; reducing packaging media contribution to foreign material. This can be most important for the packaging of bare die, CSP and mini-MLF / QFN devices.

‘J’ series is available for use with type ‘C’ (PS+C) carrier material.

Additional information can be found here.

Or, click here to download a carrier tape product overview.

Advantek continues to advance component packaging products for the semiconductor industry. From embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC desiccant and wafer laminating tape, trust us to be your one stop, high volume global source.