Introducing ‘J’ series carrier tape for burr reduction

Advantek introduces ‘J’ series carrier tape for additional control over burrs.

Reducing potential sources of particulates during assembly, test and transportation continues to grow in importance. ‘J’ series carrier tape provides notably tighter burr control for carrier tape; reducing packaging media contribution to foreign material. This can be most important for the packaging of bare die, CSP and mini-MLF / QFN devices.

‘J’ series is available for use with type ‘C’ (PS+C) carrier material.

Additional information can be found here.

Or, click here to download a carrier tape product overview.

Advantek continues to advance component packaging products for the semiconductor industry. From embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC desiccant and wafer laminating tape, trust us to be your one stop, high volume global source.