Advantek ProFilm™ Wafer Dicing Tapes are designed to assure consistent, precise and repeatable wafer production yields. Profilm products encompass Total Thickness Variation (TTV) control, expandable base films and a special low-extractable release liner that reduces silicon residue by a significant margin.

Available with either non-UV or UV-sensitive adhesives, ProFilm Wafer Dicing Tapes are produced utilizing specially formulated, expandable base films for unparalleled protection.

• Options - Five variations of Wafer Dicing Tape available in several widths and lengths to meet your application-specific requirements.
  

• Clarity - ProFilm Wafer Dicing Tapes are transparent and untinted in order to aid both human and electronic vision die defect recognition.
  

• World wide distribution network - we have over 30 sales and stocking distribution facilities globally. All are ready to serve your component packaging needs.
  

ProFilm™ DX112A Wafer Dicing Tape
ProFilm™ DX266C Wafer Dicing Tape
ProFilm™ DX102F Wafer Dicing Tape
ProFilm™ DU099D Wafer Dicing Tape (UV Adhesive)
ProFilm™ DU177E Wafer Dicing Tape (UV Adhesive)