Products
Advantek ProFilm™ wafer dicing tapes are designed to assure consistent, precise and repeatable wafer production yields. ProFilm™ products use Total Thickness Variation (TTV) control, expandable base films and a special low-extractable release liner that reduces silicon residue by a significant margin. UV and Non UV cured versions are available. For details about each product in our line of dicing tapes, please select a data sheet:
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