Dicing Tape > ProFilm™ DX266C

Advantek ProFilm™ DX266C, a protective surface fi lm, is designed to ensure consistent, precise and repeatable wafer production yields. Enhanced by superior coating technology, DX266C delivers Total Thickness Variation (TTV) control, expandable base fi lm and a special low-extractable release liner to signifi cantly reduce silicon residue.

• Thick film, excellent for substrate dicing
• Specially formulated PVC film for unparalleled protection
• Coated with stable bond pressure sensitive adhesive
• Results in consistent release of sawn die
• Film is transparent and untinted to help human and electronic vision die defect recognition

Construction

Advantek ProFilm™ DX266C is constructed in three layers:

Configurations

DX266C is available in a variety of confi gurations. Standard widths include 200mm, 230mm, 250mm, 275mm, 300mm, 330mm and 400mm. Rolls are 100mm in length, splice-free, and wound on a 3” I.D. plastic core. Both custom widths and lengths may be available by special request. ProFilm™ DX266C rolls are polybag wrapped and individually boxed.

Shelf Life and Storage

Advantek ProFilm™ DX266C should be stored in a climate controlled environment where conditions do not exceed 25°C (75°F). If stored as recommended, the product will yield a shelf life of 6 months from the date of manufacture found on the core label.

¹Bond Test on Stainless Steel Wafer at 180° peel angle and 300mm/min peel and stretching speed. The values presented for this product are typical laboratory data and may be changed without notice.

The above is typical data and should not be used for any specification purposes.