Advantek ProFilm™ wafer dicing tapes are designed to assure consistent, precise and repeatable wafer production yields. ProFilm™ products use Total Thickness Variation (TTV) control, expandable base films and a special low-extractable release liner that reduces silicon residue by a significant margin. UV and Non UV cured versions are available.
For details about each product in our line of dicing tapes, please select a data sheet:
|ProFilm DU310J Dicing Tape||T-10078-0||Details|
|ProFilm DU099D Ultraviolet Dicing Tape||T-10073-0||Details|
|ProFilm DU177E Ultraviolet Dicing Tape||T-10074-0||Details|
|ProFilm DX266C Dicing Tape||T-10072-0||Details|
|ProFilm DX102F Dicing Tape||T-10075-0||Details|