SMT HYBRID PACKAGING 2011

Come see us at SMT HYBRID PACKAGING 2011 in Nuremberg, Germany, May 3-5, 2011, Booth 7-222.

http://www.mesago.de/en/SMT/For_visitors/Welcome/index.htm

The show aims to offer for exhibit and discussion the latest products, services and solutions in the field of electronic manufacturing – covering from assembly, PCB and soldering to test.

Advantek continues to advance component packaging for the semiconductor industry. From embossed carrier tape, cover tape and LOKREEL (packaging reels) to HIC desiccant and wafer laminating tape, trust us to be your one stop, high volume global source.